Signal integrity design for high-performance, low-cost interconnects and optoelectronics

Josh G. Nickel; Stanford W. Crane; Myoung Soo Jeon; Ton Wang; Zsolt Horvath; Sangwook Lee; Andreas C. Cangellaris

doi:10.1109/SPI.2002.258275

Signal integrity design for high-performance, low-cost interconnects and optoelectronics

Josh G. Nickel, Stanford W. Crane, Myoung Soo Jeon, Ton Wang, Zsolt Horvath, Sangwook Lee, Andreas C. Cangellaris

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We present enabling technologies for the high-speed high-performance optical and electronic components market. While signal integrity requirements are paramount to these interconnect and packages, design must include other critical multidisciplinary considerations such as manufacturing, hermeticity, optical alignment, thermal dissipation, and most importantly, cost.

Original language	English (US)
Title of host publication	Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI
Pages	55-58
Number of pages	4
DOIs	https://doi.org/10.1109/SPI.2002.258275
State	Published - 2002
Event	6th IEEE Workshop on Signal Propagation on Interconnects, SPI - Pisa, Italy Duration: May 12 2002 → May 15 2002

Publication series

Name	Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI

Other

Other	6th IEEE Workshop on Signal Propagation on Interconnects, SPI
Country/Territory	Italy
City	Pisa
Period	5/12/02 → 5/15/02

ASJC Scopus subject areas

Signal Processing
Computer Networks and Communications

Online availability

10.1109/SPI.2002.258275

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Nickel, J. G., Crane, S. W., Jeon, M. S., Wang, T., Horvath, Z., Lee, S., & Cangellaris, A. C. (2002). Signal integrity design for high-performance, low-cost interconnects and optoelectronics. In Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI (pp. 55-58). [4027654] (Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI). https://doi.org/10.1109/SPI.2002.258275

Signal integrity design for high-performance, low-cost interconnects and optoelectronics. / Nickel, Josh G.; Crane, Stanford W.; Jeon, Myoung Soo et al.

Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI. 2002. p. 55-58 4027654 (Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Nickel, JG, Crane, SW, Jeon, MS, Wang, T, Horvath, Z, Lee, S & Cangellaris, AC 2002, Signal integrity design for high-performance, low-cost interconnects and optoelectronics. in Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI., 4027654, Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp. 55-58, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, Pisa, Italy, 5/12/02. https://doi.org/10.1109/SPI.2002.258275

Nickel JG, Crane SW, Jeon MS, Wang T, Horvath Z, Lee S et al. Signal integrity design for high-performance, low-cost interconnects and optoelectronics. In Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI. 2002. p. 55-58. 4027654. (Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI). https://doi.org/10.1109/SPI.2002.258275

@inproceedings{6860e385a24449f284e980e0c07fab58,

title = "Signal integrity design for high-performance, low-cost interconnects and optoelectronics",

abstract = "We present enabling technologies for the high-speed high-performance optical and electronic components market. While signal integrity requirements are paramount to these interconnect and packages, design must include other critical multidisciplinary considerations such as manufacturing, hermeticity, optical alignment, thermal dissipation, and most importantly, cost.",

author = "Nickel, {Josh G.} and Crane, {Stanford W.} and Jeon, {Myoung Soo} and Ton Wang and Zsolt Horvath and Sangwook Lee and Cangellaris, {Andreas C.}",

year = "2002",

doi = "10.1109/SPI.2002.258275",

language = "English (US)",

isbn = "0780398211",

series = "Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI",

pages = "55--58",

booktitle = "Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI",

note = "6th IEEE Workshop on Signal Propagation on Interconnects, SPI ; Conference date: 12-05-2002 Through 15-05-2002",

}

TY - GEN

T1 - Signal integrity design for high-performance, low-cost interconnects and optoelectronics

AU - Nickel, Josh G.

AU - Crane, Stanford W.

AU - Jeon, Myoung Soo

AU - Wang, Ton

AU - Horvath, Zsolt

AU - Lee, Sangwook

AU - Cangellaris, Andreas C.

PY - 2002

Y1 - 2002

N2 - We present enabling technologies for the high-speed high-performance optical and electronic components market. While signal integrity requirements are paramount to these interconnect and packages, design must include other critical multidisciplinary considerations such as manufacturing, hermeticity, optical alignment, thermal dissipation, and most importantly, cost.

AB - We present enabling technologies for the high-speed high-performance optical and electronic components market. While signal integrity requirements are paramount to these interconnect and packages, design must include other critical multidisciplinary considerations such as manufacturing, hermeticity, optical alignment, thermal dissipation, and most importantly, cost.

UR - http://www.scopus.com/inward/record.url?scp=46649089932&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=46649089932&partnerID=8YFLogxK

U2 - 10.1109/SPI.2002.258275

DO - 10.1109/SPI.2002.258275

M3 - Conference contribution

AN - SCOPUS:46649089932

SN - 0780398211

SN - 9780780398214

T3 - Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI

SP - 55

EP - 58

BT - Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI

T2 - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI

Y2 - 12 May 2002 through 15 May 2002

ER -

Signal integrity design for high-performance, low-cost interconnects and optoelectronics

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