TY - GEN
T1 - Signal integrity design for high-performance, low-cost interconnects and optoelectronics
AU - Nickel, Josh G.
AU - Crane, Stanford W.
AU - Jeon, Myoung Soo
AU - Wang, Ton
AU - Horvath, Zsolt
AU - Lee, Sangwook
AU - Cangellaris, Andreas C.
PY - 2002
Y1 - 2002
N2 - We present enabling technologies for the high-speed high-performance optical and electronic components market. While signal integrity requirements are paramount to these interconnect and packages, design must include other critical multidisciplinary considerations such as manufacturing, hermeticity, optical alignment, thermal dissipation, and most importantly, cost.
AB - We present enabling technologies for the high-speed high-performance optical and electronic components market. While signal integrity requirements are paramount to these interconnect and packages, design must include other critical multidisciplinary considerations such as manufacturing, hermeticity, optical alignment, thermal dissipation, and most importantly, cost.
UR - http://www.scopus.com/inward/record.url?scp=46649089932&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=46649089932&partnerID=8YFLogxK
U2 - 10.1109/SPI.2002.258275
DO - 10.1109/SPI.2002.258275
M3 - Conference contribution
AN - SCOPUS:46649089932
SN - 0780398211
SN - 9780780398214
T3 - Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI
SP - 55
EP - 58
BT - Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI
T2 - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI
Y2 - 12 May 2002 through 15 May 2002
ER -