Signal integrity design for high-performance, low-cost interconnects and optoelectronics

Josh G. Nickel, Stanford W. Crane, Myoung Soo Jeon, Ton Wang, Zsolt Horvath, Sangwook Lee, Andreas C. Cangellaris

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We present enabling technologies for the high-speed high-performance optical and electronic components market. While signal integrity requirements are paramount to these interconnect and packages, design must include other critical multidisciplinary considerations such as manufacturing, hermeticity, optical alignment, thermal dissipation, and most importantly, cost.

Original languageEnglish (US)
Title of host publicationProceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI
Pages55-58
Number of pages4
DOIs
StatePublished - 2002
Event6th IEEE Workshop on Signal Propagation on Interconnects, SPI - Pisa, Italy
Duration: May 12 2002 → May 15 2002

Publication series

NameProceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI

Other

Other6th IEEE Workshop on Signal Propagation on Interconnects, SPI
CountryItaly
CityPisa
Period5/12/02 → 5/15/02

ASJC Scopus subject areas

  • Signal Processing
  • Computer Networks and Communications

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    Nickel, J. G., Crane, S. W., Jeon, M. S., Wang, T., Horvath, Z., Lee, S., & Cangellaris, A. C. (2002). Signal integrity design for high-performance, low-cost interconnects and optoelectronics. In Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI (pp. 55-58). [4027654] (Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI). https://doi.org/10.1109/SPI.2002.258275