Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging

  • Ram Krishna
  • , Atom O. Watanabe
  • , John W. Golz
  • , Ravi Bonam
  • , Frank R. Libsch
  • , Elyse Rosenbaum
  • , Arvind Kumar

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Keyphrases

Engineering

Computer Science