Abstract
The silicon-germanium on insulator (SGOI) substrates were fabricated by using etch-back and smart-cut approaches. The fabrication of strained-Si nMOSFET was demonstrated and the electron mobility enhancement was also evaluated. Results of etch pit density (EPD) experiment showed no visible misfit dislocation between the top Si film and the relaxed SiGe layer. The charge density and interface charge density in the control LTO/Si structure were observed to be 2.4×1011 /cm2 and 5×1010 /cm2 eV.
Original language | English (US) |
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Pages | 13-14 |
Number of pages | 2 |
State | Published - 2001 |
Externally published | Yes |
Event | 2001 IEEE International SOI Conference - Durango, CO, United States Duration: Oct 1 2001 → Oct 4 2001 |
Other
Other | 2001 IEEE International SOI Conference |
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Country/Territory | United States |
City | Durango, CO |
Period | 10/1/01 → 10/4/01 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering