Si-SiO2 composite MEMS resonators in CMOS compatible wafer-scale thin-film encapsulation

Bongsang Kim, Renata Melamud, Matthew A. Hopcroft, Saurabh A. Chandorkar, Gaurav Bahl, Matthew Messana, Rob N. Candler, Gary Yama, Thomas Kenny

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Si-SiO2 composite resonators in wafer-scale thin-film encapsulation are demonstrated. These resonators are fabricated in hermetic wafer-scale thin-film encapsulation, which enables mass production with high yield even after harsh post processes. Also this encapsulation provides potential for integration of frequency references with CMOS circuitry. The encapsulated composite resonators exhibit tunable temperature dependence of resonant frequency with a high quality factor of much larger than 10,000. Up to 40× improvement in temperature stability was demonstrated.

Original languageEnglish (US)
Title of host publication2007 IEEE International Frequency Control Symposium Joint with the 21st European Frequency and Time Forum, FCS
Pages1214-1219
Number of pages6
DOIs
StatePublished - Dec 1 2007
Externally publishedYes
Event2007 IEEE International Frequency Control Symposium Joint with the 21st European Frequency and Time Forum, FCS - Geneva, Switzerland
Duration: May 29 2007Jun 1 2007

Publication series

NameProceedings of the IEEE International Frequency Control Symposium and Exposition

Other

Other2007 IEEE International Frequency Control Symposium Joint with the 21st European Frequency and Time Forum, FCS
CountrySwitzerland
CityGeneva
Period5/29/076/1/07

ASJC Scopus subject areas

  • Engineering(all)

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