Abstract
A shuttle mask has different chips on the same mask. The chips are not electrically connected. Alliance and foundry customers can utilize shuttle masks to share the rising cost of mask and wafer manufacturing. This paper studies the shuttle mask floorplan problem, which is formulated as a rectangle-packing problem with constraints of final die sawing strategy and die-to-die mask inspection. For our formulation, we offer a "merging" method that reduces the problem to an unconstrained slicing floorplan problem. Excellent results are obtained from the experiment with real industry data. We also study a "general" method and discuss the reason why it does not work very well.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 185-194 |
| Number of pages | 10 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 5256 |
| Issue number | 1 |
| DOIs | |
| State | Published - 2003 |
| Event | 23rd Annual BACUS Symposium on Photomask Technology - Monterey, CA, United States Duration: Sep 9 2003 → Sep 12 2003 |
Keywords
- Floorplanning
- Merging method
- Shuttle mask
- Simulated annealing
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering