Shear of Sn-3.8Ag-0.7Cu solder balls on electrodeposited FeNi layer

Q. S. Zhu, J. J. Guo, Z. G. Wang, Z. F. Zhang, J. K. Shang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The interfacial reaction between Sn-3.8Ag-0.7Cu solder and FeNi substrate was much slower, resulting in a thin FeSn2 IMC layer at the interface. Interfacial bond between FeNi and Sn-3.8Ag-0.7Cu solder ball was examined by ball shear tests and the shear test results were compared to those on Cu and deposited Ni layers. Ball shear test showed that the Sn-Ag-Cu/FeNi-Cu interface had a comparable strength to that of Sn-Ag-Cu/Cu interface and the shear strength was relatively constant when reflow time increased from 2 minutes to over 15 minutes. The shear fracture occurred within the solder near the interface. Therefore, the electrodeposited FeNi layer may be used as a reliable under ball metallization (UBM).

Original languageEnglish (US)
Title of host publicationProceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
DOIs
StatePublished - 2008
Event2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008 - Pudong, Shanghai, China
Duration: Jul 28 2008Jul 31 2008

Publication series

NameProceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Other

Other2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
CountryChina
CityPudong, Shanghai
Period7/28/087/31/08

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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