Sensor fusion for structural tilt estimation using an acceleration-based tilt sensor and a gyroscope

Cheng Liu, Jong Woong Park, B. F. Spencer, Do Soo Moon, Jiansheng Fan

Research output: Contribution to journalArticle

Abstract

A tilt sensor can provide useful information regarding the health of structural systems. Most existing tilt sensors are gravity/acceleration based and can provide accurate measurements of static responses. However, for dynamic tilt, acceleration can dramatically affect the measured responses due to crosstalk. Thus, dynamic tilt measurement is still a challenging problem. One option is to integrate the output of a gyroscope sensor, which measures the angular velocity, to obtain the tilt; however, problems arise because the low-frequency sensitivity of the gyroscope is poor. This paper proposes a new approach to dynamic tilt measurements, fusing together information from a MEMS-based gyroscope and an acceleration-based tilt sensor. The gyroscope provides good estimates of the tilt at higher frequencies, whereas the acceleration measurements are used to estimate the tilt at lower frequencies. The Tikhonov regularization approach is employed to fuse these measurements together and overcome the ill-posed nature of the problem. The solution is carried out in the frequency domain and then implemented in the time domain using FIR filters to ensure stability. The proposed method is validated numerically and experimentally to show that it performs well in estimating both the pseudo-static and dynamic tilt measurements.

Original languageEnglish (US)
Article number105005
JournalSmart Materials and Structures
Volume26
Issue number10
DOIs
StatePublished - Sep 1 2017

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Keywords

  • acceleration-based tilt
  • data fusion
  • gyroscope-based tilt
  • structural health monitoring
  • tilt measurement

ASJC Scopus subject areas

  • Signal Processing
  • Civil and Structural Engineering
  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Electrical and Electronic Engineering

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