Self-healing thermoplastic-toughened epoxy

A. R. Jones, C. A. Watkins, S. R. White, N. R. Sottos

Research output: Contribution to journalArticlepeer-review


A thermoplastic resin poly(bisphenol A-co-epichlorohydrin) (PBAE) is blended with a high glass transition temperature (Tg) epoxy matrix to serve as both a toughening additive and a healing agent in combination with an encapsulated solvent. Microcapsules are coated with poly(dopamine) (PDA) to improve the thermal stability and retain the core solvent during curing at 180 °C. The fracture toughness of the high Tg epoxy (EPON 828: diamino diphenyl sulfone) is doubled by the addition of 20 wt % PBAE alone and tripled by the addition of both microcapsules and the thermoplastic phase. Self-healing is achieved with up to 57% recovery of virgin fracture toughness of the toughened epoxy. Healing performance and fracture toughness of the self-healing system remain stable after aging 30 days. The relative amount of thermoplastic phase and the presence of solvent-filled microcapsules influence the storage modulus, Tg, and healing performance of the polymer.

Original languageEnglish (US)
Pages (from-to)254-261
Number of pages8
StatePublished - Sep 15 2015


  • Microcapsule
  • Self-healing
  • Thermoplastic-toughened epoxy

ASJC Scopus subject areas

  • Organic Chemistry
  • Polymers and Plastics
  • Materials Chemistry


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