Self-healing thermoplastic-toughened epoxy

A. R. Jones; C. A. Watkins; S. R. White; N. R. Sottos

doi:10.1016/j.polymer.2015.07.028

Self-healing thermoplastic-toughened epoxy

A. R. Jones, C. A. Watkins, S. R. White, N. R. Sottos

Research output: Contribution to journal › Article › peer-review

Abstract

A thermoplastic resin poly(bisphenol A-co-epichlorohydrin) (PBAE) is blended with a high glass transition temperature (T_g) epoxy matrix to serve as both a toughening additive and a healing agent in combination with an encapsulated solvent. Microcapsules are coated with poly(dopamine) (PDA) to improve the thermal stability and retain the core solvent during curing at 180 °C. The fracture toughness of the high T_g epoxy (EPON 828: diamino diphenyl sulfone) is doubled by the addition of 20 wt % PBAE alone and tripled by the addition of both microcapsules and the thermoplastic phase. Self-healing is achieved with up to 57% recovery of virgin fracture toughness of the toughened epoxy. Healing performance and fracture toughness of the self-healing system remain stable after aging 30 days. The relative amount of thermoplastic phase and the presence of solvent-filled microcapsules influence the storage modulus, T_g, and healing performance of the polymer.

Original language	English (US)
Pages (from-to)	254-261
Number of pages	8
Journal	Polymer
Volume	74
DOIs	https://doi.org/10.1016/j.polymer.2015.07.028
State	Published - Sep 15 2015

Keywords

Microcapsule
Self-healing
Thermoplastic-toughened epoxy

ASJC Scopus subject areas

Organic Chemistry
Polymers and Plastics
Materials Chemistry

Online availability

10.1016/j.polymer.2015.07.028

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title = "Self-healing thermoplastic-toughened epoxy",

abstract = "A thermoplastic resin poly(bisphenol A-co-epichlorohydrin) (PBAE) is blended with a high glass transition temperature (Tg) epoxy matrix to serve as both a toughening additive and a healing agent in combination with an encapsulated solvent. Microcapsules are coated with poly(dopamine) (PDA) to improve the thermal stability and retain the core solvent during curing at 180 °C. The fracture toughness of the high Tg epoxy (EPON 828: diamino diphenyl sulfone) is doubled by the addition of 20 wt % PBAE alone and tripled by the addition of both microcapsules and the thermoplastic phase. Self-healing is achieved with up to 57% recovery of virgin fracture toughness of the toughened epoxy. Healing performance and fracture toughness of the self-healing system remain stable after aging 30 days. The relative amount of thermoplastic phase and the presence of solvent-filled microcapsules influence the storage modulus, Tg, and healing performance of the polymer.",

keywords = "Microcapsule, Self-healing, Thermoplastic-toughened epoxy",

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AU - Jones, A. R.

AU - Watkins, C. A.

AU - White, S. R.

AU - Sottos, N. R.

PY - 2015/9/15

Y1 - 2015/9/15

N2 - A thermoplastic resin poly(bisphenol A-co-epichlorohydrin) (PBAE) is blended with a high glass transition temperature (Tg) epoxy matrix to serve as both a toughening additive and a healing agent in combination with an encapsulated solvent. Microcapsules are coated with poly(dopamine) (PDA) to improve the thermal stability and retain the core solvent during curing at 180 °C. The fracture toughness of the high Tg epoxy (EPON 828: diamino diphenyl sulfone) is doubled by the addition of 20 wt % PBAE alone and tripled by the addition of both microcapsules and the thermoplastic phase. Self-healing is achieved with up to 57% recovery of virgin fracture toughness of the toughened epoxy. Healing performance and fracture toughness of the self-healing system remain stable after aging 30 days. The relative amount of thermoplastic phase and the presence of solvent-filled microcapsules influence the storage modulus, Tg, and healing performance of the polymer.

AB - A thermoplastic resin poly(bisphenol A-co-epichlorohydrin) (PBAE) is blended with a high glass transition temperature (Tg) epoxy matrix to serve as both a toughening additive and a healing agent in combination with an encapsulated solvent. Microcapsules are coated with poly(dopamine) (PDA) to improve the thermal stability and retain the core solvent during curing at 180 °C. The fracture toughness of the high Tg epoxy (EPON 828: diamino diphenyl sulfone) is doubled by the addition of 20 wt % PBAE alone and tripled by the addition of both microcapsules and the thermoplastic phase. Self-healing is achieved with up to 57% recovery of virgin fracture toughness of the toughened epoxy. Healing performance and fracture toughness of the self-healing system remain stable after aging 30 days. The relative amount of thermoplastic phase and the presence of solvent-filled microcapsules influence the storage modulus, Tg, and healing performance of the polymer.

KW - Microcapsule

KW - Self-healing

KW - Thermoplastic-toughened epoxy

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JO - Polymer

JF - Polymer

ER -

Self-healing thermoplastic-toughened epoxy

Abstract

Keywords

ASJC Scopus subject areas

Online availability

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