Self-healing of a high temperature cured epoxy using poly(dimethylsiloxane) chemistry

C. L. Mangun, A. C. Mader, N. R. Sottos, S. R. White

Research output: Contribution to journalArticlepeer-review


A high temperature cured self-healing epoxy is demonstrated by incorporating microcapsules of poly(dimethylsiloxane) (PDMS) resin and separate microcapsules containing an organotin catalyst. Healing is triggered by crack propagation through the embedded microcapsules in the epoxy matrix, which releases the healing agents into the crack plane initiating crosslinking reactions. A series of tapered double-cantilever beam (TDCB) fracture tests were conducted to measure virgin and healed fracture toughness. Healing efficiencies, based on fracture toughness recovery, ranged from 11 to 51% depending on the molecular weight of PDMS resin, quantity of healing agent delivered, and use of adhesion promoters.

Original languageEnglish (US)
Pages (from-to)4063-4068
Number of pages6
Issue number18
StatePublished - Aug 2010


  • Autonomic materials
  • Microcapsules
  • Self-healing

ASJC Scopus subject areas

  • Organic Chemistry
  • Polymers and Plastics


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