@inproceedings{cf55661dc6a84eac8a388dc17dfc09d6,
title = "Self-assembly for three dimensional integration of functional electrical components",
abstract = "Current microelectronics manufacturing and packaging rely on pick-and-place methods, a serial manufacturing process. Self-Assembly (SA) is a parallel manufacturing process that can be three dimensional and as such could improve the manufacture of systems that require diverse integration of sensors, actuators, electronics, and power sources. This paper describes SA of millimeter-scale parts in which functional electronic components and electrical interconnects were cast into 5 mm cubes of Polymethylmethacrylate (PMMA). Surface forces induced both gross and fine alignment of the cubes. The cubes were bonded using low-melting temperature solder (47 °C), resulting in a self-assembled three dimensional circuit. This technique could be expanded for assembly of systems having more than 104 components. The ultimate goal is to combine a large number of diverse active components to allow the manufacture of systems having dense integrated functionality.",
keywords = "Capillary Forces, Microelectronics, Self-Assembly, Surface Tension, Three Dimensional Packaging",
author = "Cannon, {Andrew H.} and Henderson, {Clifford L.} and Yueming Hua and King, {William P.}",
year = "2006",
language = "English (US)",
isbn = "0791842002",
series = "Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005",
pages = "1943--1948",
booktitle = "Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems",
note = "ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 ; Conference date: 17-07-2005 Through 22-07-2005",
}