Self-assembly for three dimensional integration of functional electrical components

Andrew H. Cannon, Clifford L. Henderson, Yueming Hua, William P. King

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Current microelectronics manufacturing and packaging rely on pick-and-place methods, a serial manufacturing process. Self-Assembly (SA) is a parallel manufacturing process that can be three dimensional and as such could improve the manufacture of systems that require diverse integration of sensors, actuators, electronics, and power sources. This paper describes SA of millimeter-scale parts in which functional electronic components and electrical interconnects were cast into 5 mm cubes of Polymethylmethacrylate (PMMA). Surface forces induced both gross and fine alignment of the cubes. The cubes were bonded using low-melting temperature solder (47 °C), resulting in a self-assembled three dimensional circuit. This technique could be expanded for assembly of systems having more than 104 components. The ultimate goal is to combine a large number of diverse active components to allow the manufacture of systems having dense integrated functionality.

Original languageEnglish (US)
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publicationAdvances in Electronic Packaging 2005
Pages1943-1948
Number of pages6
StatePublished - Feb 23 2006
Externally publishedYes
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: Jul 17 2005Jul 22 2005

Publication series

NameProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
VolumePART C

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
CountryUnited States
CitySan Francisco, CA
Period7/17/057/22/05

Keywords

  • Capillary Forces
  • Microelectronics
  • Self-Assembly
  • Surface Tension
  • Three Dimensional Packaging

ASJC Scopus subject areas

  • Engineering(all)

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