Self-aligned double patterning decomposition for overlay minimization and hot spot detection

Hongbo Zhang, Yuelin Du, Martin D F Wong, Rasit Topaloglu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Self-aligned double patterning (SADP) lithography is a promising technology which can reduce the overlay and print 2D features for sub-32nm process. Yet, how to decompose a layout to minimize the overlay and perform hot spot detection is still an open problem. In this paper, we present an algorithm that can optimally solve the SADP decomposition problem. For a decomposable layout, our algorithm guarantees to find a decomposition solution that minimizes overlay. For a non-decomposable layout our algorithm guarantees to find all hot spots. Experimental results validate our method, and decomposition results for Nangate Open Cell Library and larger testcases are also provided with competitive run-times.

Original languageEnglish (US)
Title of host publication2011 48th ACM/EDAC/IEEE Design Automation Conference, DAC 2011
Pages71-76
Number of pages6
StatePublished - Sep 16 2011
Event2011 48th ACM/EDAC/IEEE Design Automation Conference, DAC 2011 - San Diego, CA, United States
Duration: Jun 5 2011Jun 9 2011

Publication series

NameProceedings - Design Automation Conference
ISSN (Print)0738-100X

Other

Other2011 48th ACM/EDAC/IEEE Design Automation Conference, DAC 2011
CountryUnited States
CitySan Diego, CA
Period6/5/116/9/11

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Keywords

  • 2D decomposition
  • ILP
  • SADP
  • hot-spot detection
  • overlay minimization

ASJC Scopus subject areas

  • Computer Science Applications
  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Modeling and Simulation

Cite this

Zhang, H., Du, Y., Wong, M. D. F., & Topaloglu, R. (2011). Self-aligned double patterning decomposition for overlay minimization and hot spot detection. In 2011 48th ACM/EDAC/IEEE Design Automation Conference, DAC 2011 (pp. 71-76). [5981704] (Proceedings - Design Automation Conference).