Segregant-induced cavitation of Sn/Cu reactive interface

P. L. Liu; J. K. Shang

doi:10.1016/j.scriptamat.2005.05.033

Segregant-induced cavitation of Sn/Cu reactive interface

P. L. Liu
, J. K. Shang

Research output: Contribution to journal › Article › peer-review

Abstract

A dense population of voids was found along the interface between Cu ₃Sn and Cu following prolonged aging. The voids appeared only on the Cu₃Sn/Cu interface that had been covered by roughly monolayer of Bi segregant. Void formation was related to vacancy condensation after the segregant took up vacancy sinks.

Original language	English (US)
Pages (from-to)	631-634
Number of pages	4
Journal	Scripta Materialia
Volume	53
Issue number	6
DOIs	https://doi.org/10.1016/j.scriptamat.2005.05.033
State	Published - Sep 2005
Externally published	Yes

Keywords

Fracture
Interface
Segregation
Soldering

ASJC Scopus subject areas

Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys
General Materials Science

Online availability

10.1016/j.scriptamat.2005.05.033

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title = "Segregant-induced cavitation of Sn/Cu reactive interface",

abstract = "A dense population of voids was found along the interface between Cu 3Sn and Cu following prolonged aging. The voids appeared only on the Cu3Sn/Cu interface that had been covered by roughly monolayer of Bi segregant. Void formation was related to vacancy condensation after the segregant took up vacancy sinks.",

keywords = "Fracture, Interface, Segregation, Soldering",

author = "Liu, \{P. L.\} and Shang, \{J. K.\}",

year = "2005",

month = sep,

doi = "10.1016/j.scriptamat.2005.05.033",

language = "English (US)",

volume = "53",

pages = "631--634",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Acta Materialia Inc",

number = "6",

}

TY - JOUR

T1 - Segregant-induced cavitation of Sn/Cu reactive interface

AU - Liu, P. L.

AU - Shang, J. K.

PY - 2005/9

Y1 - 2005/9

N2 - A dense population of voids was found along the interface between Cu 3Sn and Cu following prolonged aging. The voids appeared only on the Cu3Sn/Cu interface that had been covered by roughly monolayer of Bi segregant. Void formation was related to vacancy condensation after the segregant took up vacancy sinks.

AB - A dense population of voids was found along the interface between Cu 3Sn and Cu following prolonged aging. The voids appeared only on the Cu3Sn/Cu interface that had been covered by roughly monolayer of Bi segregant. Void formation was related to vacancy condensation after the segregant took up vacancy sinks.

KW - Fracture

KW - Interface

KW - Segregation

KW - Soldering

UR - https://www.scopus.com/pages/publications/21344461516

UR - https://www.scopus.com/pages/publications/21344461516#tab=citedBy

U2 - 10.1016/j.scriptamat.2005.05.033

DO - 10.1016/j.scriptamat.2005.05.033

M3 - Article

AN - SCOPUS:21344461516

SN - 1359-6462

VL - 53

SP - 631

EP - 634

JO - Scripta Materialia

JF - Scripta Materialia

IS - 6

ER -

Segregant-induced cavitation of Sn/Cu reactive interface

Abstract

Keywords

ASJC Scopus subject areas

Online availability

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