Segregant-induced cavitation of Sn/Cu reactive interface

P. L. Liu, Jian Ku Shang

Research output: Contribution to journalArticlepeer-review

Abstract

A dense population of voids was found along the interface between Cu 3Sn and Cu following prolonged aging. The voids appeared only on the Cu3Sn/Cu interface that had been covered by roughly monolayer of Bi segregant. Void formation was related to vacancy condensation after the segregant took up vacancy sinks.

Original languageEnglish (US)
Pages (from-to)631-634
Number of pages4
JournalScripta Materialia
Volume53
Issue number6
DOIs
StatePublished - Sep 1 2005

Keywords

  • Fracture
  • Interface
  • Segregation
  • Soldering

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Metals and Alloys

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