A dense population of voids was found along the interface between Cu 3Sn and Cu following prolonged aging. The voids appeared only on the Cu3Sn/Cu interface that had been covered by roughly monolayer of Bi segregant. Void formation was related to vacancy condensation after the segregant took up vacancy sinks.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- General Materials Science
- Metals and Alloys