Scanning the Issue Interconnections—Addressing the Next Challenge of IC Technology (Part II: Design, Characterization, and Modeling)

Jose E. Schutt-Aine, Sung Mo Kang

Research output: Contribution to journalEditorialpeer-review

Original languageEnglish (US)
Pages (from-to)583-585
Number of pages3
JournalProceedings of the IEEE
Issue number5
StatePublished - 2001

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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