| Original language | English (US) |
|---|---|
| Pages (from-to) | 583-585 |
| Number of pages | 3 |
| Journal | Proceedings of the IEEE |
| Volume | 89 |
| Issue number | 5 |
| DOIs | |
| State | Published - 2001 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Scanning the Issue Interconnections—Addressing the Next Challenge of IC Technology (Part II: Design, Characterization, and Modeling)
Jose E. Schutt-Aine, Sung Mo Kang
Research output: Contribution to journal › Editorial › peer-review