Abstract
Crack-free and low-bow (< 50 μm) AlGaN/GaN high electron mobility transistor (HEMT) structures are grown on 200-mm diameter Si(111) substrates by using three different buffer layer configurations: (a) Thick-GaN/3 × {AlxGa1-xN}/AlN, (b) Thin-GaN/3 × {AlxGa1-xN}/AlN, and (c) Thin-GaN/AlN. Optical, structural, and electrical properties of these AlGaN/GaN HEMT structures are reported. The effects of buffer layer stacks (i.e. thickness and content) on defectivity, stress, and two-dimensional electron gas (2DEG) mobility and concentration are studied. We show that the in-plane stress type and magnitude significantly affect the 2DEG characteristic, suggesting the importance of optimal buffer layer configurations for AlGaN/GaN HEMTs on Si(111) substrates.
Original language | English (US) |
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State | Published - 2017 |
Event | 2017 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2017 - Indian Wells, United States Duration: May 22 2017 → May 25 2017 |
Other
Other | 2017 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2017 |
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Country/Territory | United States |
City | Indian Wells |
Period | 5/22/17 → 5/25/17 |
Keywords
- AlGaN
- Defectivity
- High electron mobility transistor
- Si
- Strain
- Two-dimensional electron gas
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering