@inproceedings{c98d7743683743bb8ebe58af1582c48d,
title = "S-Rum Inductors: 30-Fold Enhancement of Inductance by Controlled Electroplating Post Rolling",
abstract = "The demand on power inductors with high inductances (micro-Henries) and high current-carrying capacities to have small footprints for Internet-of-Things (IOT) and Cyber-Physical-System (CPS) applications poses design and fabrication challenges. 3D air-core microtube inductors fabricated with self-rolled-up membranes (S-RuM) can provide higher inductance densities than planar inductors, but are restricted by both high resistive losses, dependent on metal film thickness, and air-core limited magnetic core integration. This study proposes a post-rolling electroplating process for increased metal conductivity and core permeability for S-RuM inductors. S-RuM inductors with parallel-processed Au-shell and partial-plated permalloy core resulted in improvements of over 10x DC resistance (DCR) decrease and over 30x inductance boost. Such improvements are predicted to increase in magnitudes upon optimized shell and core-filling, offering the potential for scaling this technology for use in power electronics applications such as converters and filters with minimal power losses.",
keywords = "electroplating, magnetic cores, MEMS, Micro-inductors, miniaturization, on-chip, self-rolled membranes",
author = "Zhendong Yang and Apratim Khandelwal and Allen Wang and Kristen Nguyen and Scott Wicker and Shao, {Yang Victoria} and Xiuling Li",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 37th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2024 ; Conference date: 21-01-2024 Through 25-01-2024",
year = "2024",
doi = "10.1109/MEMS58180.2024.10439516",
language = "English (US)",
series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "691--692",
booktitle = "IEEE 37th International Conference on Micro Electro Mechanical Systems, MEMS 2024",
address = "United States",
}