TY - GEN
T1 - Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs
AU - Liu, Siting
AU - Jiang, Jiaxi
AU - He, Zhuolun
AU - Wang, Ziyi
AU - Lin, Yibo
AU - Yu, Bei
AU - Wong, Martin
N1 - Publisher Copyright:
© 2024 ACM.
PY - 2024/3/12
Y1 - 2024/3/12
N2 - Face-to-face (F2F) stacked 3D IC is a promising alternative for scaling beyond Moore's Law. In F2F 3D ICs, dies are connected through bonding terminals whose positions can significantly impact routing performance. Further, there exists resource competition among all the 3D nets due to the constrained bonding terminal number. In advanced technology nodes, such 3D integration may also introduce legality challenges of bonding terminals, as the metal pitches can be much smaller than the sizes of bonding terminals. Previous works attempt to insert bonding terminals automatically using existing 2D commercial P&R tools and then consider inter-die connection legality, but they fail to take the legality and routing performance into account simultaneously. In this paper, we explore the formulation of the generalized assignment in the hybrid bonding terminal assignment problem. Our framework, BTAssign, offers a strict legality guarantee and an iterative solution. The experiments are conducted on 18 open-source designs with various 3D net densities and the most advanced bonding scale. The results reveal that BTAssign can achieve improvements in routed wirelength under all testing conditions from 1.0% to 5.0% with a tolerable runtime overhead.
AB - Face-to-face (F2F) stacked 3D IC is a promising alternative for scaling beyond Moore's Law. In F2F 3D ICs, dies are connected through bonding terminals whose positions can significantly impact routing performance. Further, there exists resource competition among all the 3D nets due to the constrained bonding terminal number. In advanced technology nodes, such 3D integration may also introduce legality challenges of bonding terminals, as the metal pitches can be much smaller than the sizes of bonding terminals. Previous works attempt to insert bonding terminals automatically using existing 2D commercial P&R tools and then consider inter-die connection legality, but they fail to take the legality and routing performance into account simultaneously. In this paper, we explore the formulation of the generalized assignment in the hybrid bonding terminal assignment problem. Our framework, BTAssign, offers a strict legality guarantee and an iterative solution. The experiments are conducted on 18 open-source designs with various 3D net densities and the most advanced bonding scale. The results reveal that BTAssign can achieve improvements in routed wirelength under all testing conditions from 1.0% to 5.0% with a tolerable runtime overhead.
KW - 3d ics
KW - bonding terminal planning
KW - divide and conquer
KW - generalized assignment problem
KW - routing
UR - http://www.scopus.com/inward/record.url?scp=85188416727&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85188416727&partnerID=8YFLogxK
U2 - 10.1145/3626184.3633322
DO - 10.1145/3626184.3633322
M3 - Conference contribution
AN - SCOPUS:85188416727
T3 - Proceedings of the International Symposium on Physical Design
SP - 75
EP - 82
BT - ISPD 2024 - Proceedings of the 2024 International Symposium on Physical Design
PB - Association for Computing Machinery
T2 - 33rd International Symposium on Physical Design, ISPD 2024
Y2 - 12 March 2024 through 15 March 2024
ER -