Role of Thin Film Adhesion on Capillary Peeling

Jingcheng Ma, Jin Myung Kim, Muhammad Jahidul Hoque, Kamila J. Thompson, Sungwoo Nam, David G. Cahill, Nenad Miljkovic

Research output: Contribution to journalArticlepeer-review

Abstract

The capillary force can peel off a substrate-attached film if the adhesion energy (Gw) is low. Capillary peeling has been used as a convenient, rapid, and nondestructive method for fabricating free-standing thin films. However, the critical value of Gw, which leads to the transition between peeling and sticking, remains largely unknown. As a result, capillary peeling remains empirical and applicable to a limited set of materials. Here, we investigate the critical value of Gw and experimentally show the critical adhesion (Gw,c) to scale with the water-film interfacial energy (≈0.7γfw), which corresponds well with our theoretical prediction of Gw,c = γfw. Based on the critical adhesion, we propose quantitative thermodynamic guidelines for designing thin film interfaces that enable successful capillary peeling. The outcomes of this work present a powerful technique for thin film transfer and advanced nanofabrication in flexible photovoltaics, battery materials, biosensing, translational medicine, and stretchable bioelectronics.

Original languageEnglish (US)
Pages (from-to)9983-9989
Number of pages7
JournalNano letters
Volume21
Issue number23
DOIs
StatePublished - Dec 8 2021
Externally publishedYes

Keywords

  • 2D materials
  • adhesion
  • capillary
  • peeling
  • surface energy
  • thin film

ASJC Scopus subject areas

  • Bioengineering
  • General Chemistry
  • General Materials Science
  • Condensed Matter Physics
  • Mechanical Engineering

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