Rigorous modeling of the frequency dependence of ohmic losses in high-speed electrical interconnections

Karen M. Coperich; Andreas C. Cangellaris; Albert E. Ruehli

Rigorous modeling of the frequency dependence of ohmic losses in high-speed electrical interconnections

Karen M. Coperich, Andreas C. Cangellaris, Albert E. Ruehli

Research output: Contribution to journal › Conference article › peer-review

Abstract

A systematic methodology is presented for the development of SPICE-compatible models for printed circuit board interconnections exhibiting dispersion due to ohmic loss and skin effect. The important attributes of this methodology are: a) A rigorous and computationally efficient approach for the extraction of the per-unit-length, frequency-dependent resistance and inductance matrices for a system of coupled interconnects, b) The systematic development of an equivalent circuit for the discrete approximation of the generalized transmission line equations, that can be readily incorporated in standard SPICE-like circuit simulators.

Original language	English (US)
Pages (from-to)	301-306
Number of pages	6
Journal	IEEE International Symposium on Electromagnetic Compatibility
Volume	1
State	Published - Jan 1 2000
Event	2000 IEEE International Symposium on Electromagneti Compatibility - Washington, DC, USA Duration: Aug 21 2000 → Aug 25 2000

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

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@article{71c0edc56868457aa4c98f76e027b3ce,

title = "Rigorous modeling of the frequency dependence of ohmic losses in high-speed electrical interconnections",

abstract = "A systematic methodology is presented for the development of SPICE-compatible models for printed circuit board interconnections exhibiting dispersion due to ohmic loss and skin effect. The important attributes of this methodology are: a) A rigorous and computationally efficient approach for the extraction of the per-unit-length, frequency-dependent resistance and inductance matrices for a system of coupled interconnects, b) The systematic development of an equivalent circuit for the discrete approximation of the generalized transmission line equations, that can be readily incorporated in standard SPICE-like circuit simulators.",

author = "Coperich, {Karen M.} and Cangellaris, {Andreas C.} and Ruehli, {Albert E.}",

year = "2000",

month = jan,

day = "1",

language = "English (US)",

volume = "1",

pages = "301--306",

journal = "IEEE International Symposium on Electromagnetic Compatibility",

issn = "0190-1494",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "2000 IEEE International Symposium on Electromagneti Compatibility ; Conference date: 21-08-2000 Through 25-08-2000",

}

TY - JOUR

T1 - Rigorous modeling of the frequency dependence of ohmic losses in high-speed electrical interconnections

AU - Coperich, Karen M.

AU - Cangellaris, Andreas C.

AU - Ruehli, Albert E.

PY - 2000/1/1

Y1 - 2000/1/1

N2 - A systematic methodology is presented for the development of SPICE-compatible models for printed circuit board interconnections exhibiting dispersion due to ohmic loss and skin effect. The important attributes of this methodology are: a) A rigorous and computationally efficient approach for the extraction of the per-unit-length, frequency-dependent resistance and inductance matrices for a system of coupled interconnects, b) The systematic development of an equivalent circuit for the discrete approximation of the generalized transmission line equations, that can be readily incorporated in standard SPICE-like circuit simulators.

AB - A systematic methodology is presented for the development of SPICE-compatible models for printed circuit board interconnections exhibiting dispersion due to ohmic loss and skin effect. The important attributes of this methodology are: a) A rigorous and computationally efficient approach for the extraction of the per-unit-length, frequency-dependent resistance and inductance matrices for a system of coupled interconnects, b) The systematic development of an equivalent circuit for the discrete approximation of the generalized transmission line equations, that can be readily incorporated in standard SPICE-like circuit simulators.

UR - http://www.scopus.com/inward/record.url?scp=0033712668&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0033712668&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0033712668

VL - 1

SP - 301

EP - 306

JO - IEEE International Symposium on Electromagnetic Compatibility

JF - IEEE International Symposium on Electromagnetic Compatibility

SN - 0190-1494

T2 - 2000 IEEE International Symposium on Electromagneti Compatibility

Y2 - 21 August 2000 through 25 August 2000

ER -