Abstract
A systematic methodology is presented for the development of SPICE-compatible models for printed circuit board interconnections exhibiting dispersion due to ohmic loss and skin effect. The important attributes of this methodology are: a) A rigorous and computationally efficient approach for the extraction of the per-unit-length, frequency-dependent resistance and inductance matrices for a system of coupled interconnects, b) The systematic development of an equivalent circuit for the discrete approximation of the generalized transmission line equations, that can be readily incorporated in standard SPICE-like circuit simulators.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 301-306 |
| Number of pages | 6 |
| Journal | IEEE International Symposium on Electromagnetic Compatibility |
| Volume | 1 |
| State | Published - 2000 |
| Event | 2000 IEEE International Symposium on Electromagneti Compatibility - Washington, DC, USA Duration: Aug 21 2000 → Aug 25 2000 |
ASJC Scopus subject areas
- Condensed Matter Physics
- Electrical and Electronic Engineering