Rigorous modeling of the frequency dependence of ohmic losses in high-speed electrical interconnections

Karen M. Coperich, Andreas C. Cangellaris, Albert E. Ruehli

Research output: Contribution to journalConference articlepeer-review

Abstract

A systematic methodology is presented for the development of SPICE-compatible models for printed circuit board interconnections exhibiting dispersion due to ohmic loss and skin effect. The important attributes of this methodology are: a) A rigorous and computationally efficient approach for the extraction of the per-unit-length, frequency-dependent resistance and inductance matrices for a system of coupled interconnects, b) The systematic development of an equivalent circuit for the discrete approximation of the generalized transmission line equations, that can be readily incorporated in standard SPICE-like circuit simulators.

Original languageEnglish (US)
Pages (from-to)301-306
Number of pages6
JournalIEEE International Symposium on Electromagnetic Compatibility
Volume1
StatePublished - Jan 1 2000
Event2000 IEEE International Symposium on Electromagneti Compatibility - Washington, DC, USA
Duration: Aug 21 2000Aug 25 2000

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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