Abstract
A methodology is presented for the rigorous electromagnetic analysis of pulse transmission through first-level interconnects. The methodology combines a full-wave, vectorial, time-dependent Maxwell's equations solver with SPICE circuit models for the nonlinear drivers, to facilitate the accurate modeling of the electromagnetic phenomena occurring at the chip-to-package interface. Comparisons of the results obtained using this method with others calculated using SPICE simulations are used to validate the method and demonstrate its application in the electromagnetic modeling of high-speed packaging structures.
| Original language | English (US) |
|---|---|
| Title of host publication | Proceedings - Electronic Components and Technology Conference |
| Publisher | Publ by IEEE |
| Pages | 623-629 |
| Number of pages | 7 |
| ISBN (Print) | 0780307941 |
| State | Published - 1993 |
| Externally published | Yes |
| Event | 1993 Proceedings of the 43rd Electronic Components and Technology Conference - Orlando, FL, USA Duration: Jun 1 1993 → Jun 4 1993 |
Other
| Other | 1993 Proceedings of the 43rd Electronic Components and Technology Conference |
|---|---|
| City | Orlando, FL, USA |
| Period | 6/1/93 → 6/4/93 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering