Rigorous electromagnetic modeling of chip-to-package (first-level) interconnections

Yuh Sheng Tsuei, Andreas C. Cangellaris, John L. Prince

Research output: Chapter in Book/Report/Conference proceedingConference contribution


A methodology is presented for the rigorous electromagnetic analysis of pulse transmission through first-level interconnects. The methodology combines a full-wave, vectorial, time-dependent Maxwell's equations solver with SPICE circuit models for the nonlinear drivers, to facilitate the accurate modeling of the electromagnetic phenomena occurring at the chip-to-package interface. Comparisons of the results obtained using this method with others calculated using SPICE simulations are used to validate the method and demonstrate its application in the electromagnetic modeling of high-speed packaging structures.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherPubl by IEEE
Number of pages7
ISBN (Print)0780307941
StatePublished - 1993
Externally publishedYes
Event1993 Proceedings of the 43rd Electronic Components and Technology Conference - Orlando, FL, USA
Duration: Jun 1 1993Jun 4 1993

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503


Other1993 Proceedings of the 43rd Electronic Components and Technology Conference
CityOrlando, FL, USA

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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