Rigorous Electromagnetic Modeling of Chip-to-Package (First-Level) Interconnections

Yuh Sheng Tsuei, Andreas C. Cangellaris, John L. Prince

Research output: Contribution to journalArticlepeer-review

Abstract

A methodology is presented for the rigorous electromagnetic analysis of pulse transmission through first-level interconnects. The methodology combines a full-wave, vectorial, time-dependent Maxwell's equations solver with SPICE circuit models for the nonlinear drivers, to facilitate the accurate modeling of the electromagnetic phenomena occurring at the chip-to-package interface. Comparisons of the results obtained using this method with others calculated using SPICE simulations are used to validate the method and demonstrate its application in the electromagnetic modeling of high-speed packaging structures.

Original languageEnglish (US)
Pages (from-to)876-883
Number of pages8
JournalIEEE Transactions on Components, Hybrids, and Manufacturing Technology
Volume16
Issue number8
DOIs
StatePublished - Dec 1993
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Engineering(all)
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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