Rigorous conductor modeling of signal integrity in integrated circuits

The accurate simulation of geometrically complicated electromagnetic (EM) problems with many degrees of freedom is of vital importance in many engineering applications. We present herein a frequency-domain multi-solver domain decomposition method (MS-DDM), and apply it to accurately analyze signal integrity in multi-scale product-level ICs. Instead of using impedance boundary condition to approximate the conductor loss effect, we consider a surface integral equation domain decomposition method (SIE-DDM) for finite conductors modeling in integrated circuits (ICs). In particular, we propose a novel formulation to rigorously account for the conductor loss due to finite conductivities in metals.