Rigorous conductor modeling of signal integrity in integrated circuits

Yang Shao, Zhen Peng, Jiangong Wei, Jin Fa Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The accurate simulation of geometrically complicated electromagnetic (EM) problems with many degrees of freedom is of vital importance in many engineering applications. We present herein a frequency-domain multi-solver domain decomposition method (MS-DDM), and apply it to accurately analyze signal integrity in multi-scale product-level ICs. Instead of using impedance boundary condition to approximate the conductor loss effect, we consider a surface integral equation domain decomposition method (SIE-DDM) for finite conductors modeling in integrated circuits (ICs). In particular, we propose a novel formulation to rigorously account for the conductor loss due to finite conductivities in metals.

Original languageEnglish (US)
Title of host publication2013 USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), USNC-URSI 2013 - Proceedings
Number of pages1
DOIs
StatePublished - Dec 1 2013
Externally publishedYes
Event2013 USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), USNC-URSI 2013 - Orlando, FL, United States
Duration: Jul 7 2013Jul 13 2013

Publication series

Name2013 USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), USNC-URSI 2013 - Proceedings

Other

Other2013 USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), USNC-URSI 2013
CountryUnited States
CityOrlando, FL
Period7/7/137/13/13

ASJC Scopus subject areas

  • Computer Networks and Communications

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