Rheological behavior of fugitive organic inks for direct-write assembly

Daniel Therriault, Scott R. White, Jennifer A. Lewis

Research output: Contribution to journalArticlepeer-review

Abstract

The rheological behavior of a fugitive organic ink tailored for direct-write assembly of 3D microfluidic devices is investigated. Rheological experiments are carried out to probe the shear storage and loss moduli as well as the complex viscosity as a function of varying temperature, frequency and stress amplitude. Master curves of these functions are assembled using time-temperature superposition. The fugitive ink, comprised of two organic phases, possesses an equilibrium shear elastic modulus nearly two orders of magnitude higher than that of a commercial reference ink at room temperature and a peak in the relaxation spectrum nearly six orders of magnitude longer in time scale. The self-supporting nature of extruded ink filaments is characterized by direct video imaging. Comparison of the experimentally observed behavior to numerical predictions based on Euler-Bernoulli viscoelastic beam analysis yield excellent agreement for slender filaments.

Original languageEnglish (US)
Pages (from-to)10112-1-10112-8
JournalApplied Rheology
Volume17
Issue number1
DOIs
StatePublished - 2007
Externally publishedYes

Keywords

  • Direct-write
  • Microfabrication
  • Organic ink
  • Structural behavior
  • Viscoelastic materials

ASJC Scopus subject areas

  • Mechanics of Materials
  • Computational Mechanics

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