RFIC transformer with 12x size reduction and 15x performance enhancement by self-rolled-up membrane nanotechnology

Wen Huang, Moyang Li, Songbin Gong, Xiuling Li

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Two types of on-chip RFIC transformers based on CMOS compatible strain-induced self-rolled-up membrane (S-RuM) nanotechnology, with extremely small footprint, are demonstrated. The rolled-up transformers, with their 3D tubular form factors, dramatically reduce the substrate parasitic effects and push the maximum working frequency into millimeter wave bands with a coupling coefficient, k, as high as 0.92. The 3D stand-up nature also allows the tube transformers to be less susceptible to residue stress in the substrate and thus compatible with flexible platforms for wearable RF applications. The demonstrated samples with a turn ratio, n, of 5.5:1 only occupies 805 μm2 on-chip area (s) which is 12x smaller than that of the best planar transformer with the same turn ratio, and its figure of merit n·k/s, is therefore ~ 6046/mm2, enhanced by 15x.

Original languageEnglish (US)
Title of host publicationAdvanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791856901
DOIs
StatePublished - Jan 1 2015
EventASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, United States
Duration: Jul 6 2015Jul 9 2015

Publication series

NameASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
Volume3

Other

OtherASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
CountryUnited States
CitySan Francisco
Period7/6/157/9/15

ASJC Scopus subject areas

  • Process Chemistry and Technology

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