Residual stresses at cavity corners in silicon-on-insulator bonded wafers

T. W. Lin, O. Elkhatib, J. Makinen, M. Palokangas, H. T. Johnson, G. P. Horn

Research output: Contribution to journalArticlepeer-review

Fingerprint

Dive into the research topics of 'Residual stresses at cavity corners in silicon-on-insulator bonded wafers'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds