Residual stress relaxation and stiffness in spin-coated polymer films: Characterization by ellipsometry and fluorescence

Keyphrases

• Stress Relaxation 100%
• Residual Stress Relaxation 100%
• Polymer Film 100%
• Ellipsometry 100%
• Polystyrene Films 100%
• Stress Stiffness 100%
• Film Characterization 100%
• Stiffness 50%
• Glass Transition Temperature 50%
• Polystyrene Layer 50%
• Pyrenyl 50%
• Glass Substrate 25%
• Temperature Effect 25%
• Activation Energy 25%
• Film Thickness 25%
• Substrate Effect 25%
• Polydimethylsiloxane 25%
• Film Stress 25%
• Polystyrene 25%
• Change in Thickness 25%
• Bilayer Film 25%
• Nanosecond Time Scale 25%
• Free Surface 25%
• Soft Substrate 25%
• Measurable Change 25%
• Fluorescence Method 25%
• Free-standing Film 25%
• Spectral Shape 25%
• Stress Relaxation Time 25%
• Pyrene 25%
• Substrate Interface 25%
• Hard Substrate 25%
• Vibronic 25%
• Arrhenius Temperature 25%
• Pyrene Label 25%

Material Science

• Film 100%
• Stress Relaxation 100%
• Residual Stress 100%
• Polymer Films 100%
• Polystyrene 63%
• Glass Transition Temperature 18%
• Activation Energy 9%
• Film Thickness 9%
• Surface (Surface Science) 9%

Engineering

• Stress Relaxation 100%
• Residual Stress Relaxation 100%
• Mols 40%
• Polydimethylsiloxane 20%
• Activation Energy 20%
• Temperature Dependence 20%
• Molecular Scale 20%
• Nanosecond Time 20%
• Peak Intensity 20%
• Free Surface 20%
• Spectral Emission 20%
• Substrate Interface 20%
• Arrhenius 20%
• Glass Substrate 20%
• Relaxation Time 20%