Residual stress development during relamination of woven composite circuit boards

Keyphrases

• Residual Stress 100%
• Woven Composites 100%
• Stress Development 100%
• Composite Substrate 100%
• Warpage 100%
• Circuit Board 100%
• Numerical Procedure 66%
• Multilayer Circuit Boards 66%
• Classical Lamination Theory 33%
• Glass-epoxy Composite 33%
• Stress Relaxation Modulus 33%
• Coefficient of Thermal Expansion 33%
• Experimental Values 33%
• Scanning Method 33%
• Non-isothermal 33%
• Numerical Analysis 33%
• Residual Stress State 33%
• Non-axisymmetric 33%
• Ultrasonic 33%
• Numerical Prediction 33%
• Deformation Stress 33%
• Processing Effects 33%
• Substrate Properties 33%
• Thermomechanical Properties 33%
• C-stage 33%
• Relaxation Coefficient 33%
• Copper Foil 33%
• Model Circuit 33%
• Cycle Properties 33%
• Fabric Type 33%
• Processing Cycle 33%
• Substrate Stress 33%
• Glass-epoxy Prepreg 33%
• Viscoelastic Constitutive Relations 33%
• Residual Warpage 33%
• Residual Deformation 33%
• B-stage 33%

Engineering

• Residual Stress 100%
• Residual Stress Development 100%
• Epoxy Composite 50%
• Ultrasonics 50%
• Isothermal 50%
• Stress Relaxation 50%
• Relaxation Modulus 50%
• Constitutive Relation 50%
• Coefficient of Thermal Expansion 50%
• Stress State 50%
• Numerical Prediction 50%
• Epoxy Glass 50%
• Experimental Value 50%
• Classical Lamination Theory 50%
• Copper Foil 50%

Material Science

• Electronic Circuit 100%
• Residual Stress 100%
• Composite Material 100%
• Stress Relaxation 25%
• Thermal Expansion 25%
• Thermomechanical Property 25%
• Prepreg 25%