Keyphrases
Wafer
100%
Lithographic Masks
100%
Photomask
100%
Plasma-assisted
100%
Clean Technology
100%
Ion Bombardment
50%
High Efficiency
50%
Particulate
50%
Helium
50%
Technology Requirements
50%
Polystyrene Latex Particles
50%
Plasma Sources
50%
Removal Methods
50%
Removal Rate
50%
Integrated Circuit Manufacturing
50%
Manufacturing Technology
50%
Population Density
50%
High-density Plasma
50%
Extreme Ultraviolet Lithography
50%
Metastable Helium
50%
High Volume Manufacturing
50%
Optical Emission Spectroscopy
50%
Mask Cleaning
50%
Pellicle
50%
Cleanliness
50%
Helium Metastables
50%
Helium Metastable Atoms
50%
Particle Removal Rate
50%
Damage-free
50%
Wet Cleaning
50%
EUV Photoresist
50%
Pulsed Substrate Bias
50%
Engineering
Ion Implantation
100%
Removal Efficiency
100%
Plasma Source
100%
Removal Rate
100%
Manufacturing Engineering
100%
Substrate Bias
100%
Extreme-Ultraviolet Lithography
100%
Light Emission
100%
Integrated Circuit
100%
Material Science
Density
100%
Electronic Circuit
50%
Lithography
50%
Polystyrene
50%
Emission Spectroscopy
50%
Plasma Density
50%
Surface (Surface Science)
50%
Ion Bombardment
50%
Physics
Blood Plasma
100%
Helium Atom
33%
Polystyrene
33%
Integrated Circuit
33%
Optical Emission Spectroscopy
33%
Metastable Atom
33%
Plasma Density
33%