Reconfigurable 43 Gb/s optical link test based upon on-wafer probes of GaAs photodetectors and VCSELs up to 85°C

Yu Ting Peng, Junyi Qiu, Dufei Wu, Milton Feng

Research output: Contribution to conferencePaper

Abstract

Reconfigurable testing of a high-speed optical link based upon on-wafer probing of an oxide-confined 850 nm vertical-cavity surface-emitting laser (VCSEL) and a GaAs P-i-N photodetector (PD) is demonstrated at a non-return to zero (NRZ) modulated data rate up to 50 Gb/s at room temperature and 43 Gb/s at 85℃ over back-to-back distance. Without any impedance matching network, trans-impedance amplifier, or equalization technique present at the received side, the optical link has not only shown robustness but also achieved outstanding signal-to-noise ratios (SNRs) over the operating temperature range.

Original languageEnglish (US)
StatePublished - Jan 1 2019
Event2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019 - Minneapolis, United States
Duration: Apr 29 2019May 2 2019

Conference

Conference2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019
CountryUnited States
CityMinneapolis
Period4/29/195/2/19

Keywords

  • High-speed modulation
  • On-wafer characterization
  • Optical fiber link

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Peng, Y. T., Qiu, J., Wu, D., & Feng, M. (2019). Reconfigurable 43 Gb/s optical link test based upon on-wafer probes of GaAs photodetectors and VCSELs up to 85°C. Paper presented at 2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019, Minneapolis, United States.