Abstract
Reconfigurable testing of a high-speed optical link based upon on-wafer probing of an oxide-confined 850 nm vertical-cavity surface-emitting laser (VCSEL) and a GaAs P-i-N photodetector (PD) is demonstrated at a non-return to zero (NRZ) modulated data rate up to 50 Gb/s at room temperature and 43 Gb/s at 85℃ over back-to-back distance. Without any impedance matching network, trans-impedance amplifier, or equalization technique present at the received side, the optical link has not only shown robustness but also achieved outstanding signal-to-noise ratios (SNRs) over the operating temperature range.
| Original language | English (US) |
|---|---|
| State | Published - Jan 1 2019 |
| Event | 2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019 - Minneapolis, United States Duration: Apr 29 2019 → May 2 2019 |
Conference
| Conference | 2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019 |
|---|---|
| Country | United States |
| City | Minneapolis |
| Period | 4/29/19 → 5/2/19 |
Keywords
- High-speed modulation
- On-wafer characterization
- Optical fiber link
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering
Fingerprint Dive into the research topics of 'Reconfigurable 43 Gb/s optical link test based upon on-wafer probes of GaAs photodetectors and VCSELs up to 85°C'. Together they form a unique fingerprint.
Cite this
Peng, Y. T., Qiu, J., Wu, D., & Feng, M. (2019). Reconfigurable 43 Gb/s optical link test based upon on-wafer probes of GaAs photodetectors and VCSELs up to 85°C. Paper presented at 2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019, Minneapolis, United States.