@inproceedings{65c77af09d9846e683fb90e530273678,
title = "RECO-HCON: A High-Throughput Reconfigurable Compact ASCON Processor for Trusted IoT",
abstract = "Statistics show that in 2030 the number of connected IoT devices will reach 25.44 billion, which can lead to the security breach in the back-end of high-performance computing clusters connected with the same network. Unfortunately, the current security primitives are not suitable algorithms to be implemented on physically constrained devices designed for IoT. Thus, the National Institute of Standard and Technology has announced a worldwide lightweight cryptographic competition (LWC) for securing tiny devices. This paper introduces a flexible, reconfigurable, and energy-efficient crypto-processor running one of the LWC finalist candidates - ASCON, which uses sponge construction that has fewer memory accesses that leads to less power consumption compared to other ones. The proposed processor is reconfigurable in a way both authenticated cipher (Encryption/decryption processes) and hash functions of ASCON are implemented in a six-mode compact fashion, covering a diversity of applications in the IoT spectrum. The design is developed in Chisel and evaluated in 28/32nm technology with commercial EDA tools. Evaluation results show that the proposed processor achieves the highest throughput while consuming 29% less power, operating at over 667 MHz. The design has also been implemented in Skywater 130nm technology node with the latest released OpenLane design flow to ensure an end-to-end open-source delivery of the IP.",
keywords = "ASCON, ASIC, FPGA, LWC, Reconfigurable computing",
author = "Xiangdong Wei and Mohamed El-Hadedy and Sergiu Mosanu and Zhengping Zhu and Hwu, {Wen Mei} and Xinfei Guo",
note = "Funding Information: This work has been funded by the Air Force Research Publisher Copyright: {\textcopyright} 2022 IEEE.; 35th IEEE International System-on-Chip Conference, SOCC 2022 ; Conference date: 05-09-2022 Through 08-09-2022",
year = "2022",
doi = "10.1109/SOCC56010.2022.9908100",
language = "English (US)",
series = "International System on Chip Conference",
publisher = "IEEE Computer Society",
editor = "Sakir Sezer and Thomas Buchner and Jurgen Becker and Andrew Marshall and Fahad Siddiqui and Tanja Harbaum and Kieran McLaughlin",
booktitle = "Proceedings - 2022 IEEE 35th International System-on-Chip Conference, SOCC 2022",
}