Recent Progress on Signal Integrity Modeling of Neuromorphic Chips by the PEEC Method

Hanzhi Ma; Tuomin Tao; Quankun Chen; Da Li; Jose Schutt-Aine; Andreas Cangellaris; Er Ping Li

doi:10.1109/EPEPS58208.2023.10314875

Recent Progress on Signal Integrity Modeling of Neuromorphic Chips by the PEEC Method

Hanzhi Ma, Tuomin Tao, Quankun Chen, Da Li, Jose Schutt-Aine, Andreas Cangellaris, Er Ping Li

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

With the rapid advances of artificial intelligence and its applications, the design of memristor-based neuromorphic chips inspired by the human brain has become an important area of research. Signal integrity issues, such as crosstalk and IR drop, affect the performance of these chips and necessitate the use of signal integrity modeling and analysis methods during the early stages of chips design. In this mini review, we summarize recent progress on the application of the Partial Element Equivalent Circuit (PEEC) method to the signal integrity modeling of neuromorphic chips.

Original language	English (US)
Title of host publication	EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9798350317985
DOIs	https://doi.org/10.1109/EPEPS58208.2023.10314875
State	Published - 2018
Event	32nd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2023 - Milpitas, United States Duration: Oct 15 2023 → Oct 18 2023

Publication series

Name	EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems

Conference

Conference	32nd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2023
Country/Territory	United States
City	Milpitas
Period	10/15/23 → 10/18/23

Keywords

Neuromorphic chips
partial element equivalent circuit
signal integrity

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

Online availability

10.1109/EPEPS58208.2023.10314875

Library availability

Discover UIUC Full Text

Cite this

Ma, H., Tao, T., Chen, Q., Li, D., Schutt-Aine, J., Cangellaris, A., & Li, E. P. (2018). Recent Progress on Signal Integrity Modeling of Neuromorphic Chips by the PEEC Method. In EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEPS58208.2023.10314875

Recent Progress on Signal Integrity Modeling of Neuromorphic Chips by the PEEC Method. / Ma, Hanzhi; Tao, Tuomin; Chen, Quankun et al.
EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems. Institute of Electrical and Electronics Engineers Inc., 2018. (EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ma, H, Tao, T, Chen, Q, Li, D, Schutt-Aine, J , Cangellaris, A & Li, EP 2018, Recent Progress on Signal Integrity Modeling of Neuromorphic Chips by the PEEC Method. in EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems. EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems, Institute of Electrical and Electronics Engineers Inc., 32nd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2023, Milpitas, United States, 10/15/23. https://doi.org/10.1109/EPEPS58208.2023.10314875

Ma H, Tao T, Chen Q, Li D, Schutt-Aine J , Cangellaris A et al. Recent Progress on Signal Integrity Modeling of Neuromorphic Chips by the PEEC Method. In EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems. Institute of Electrical and Electronics Engineers Inc. 2018. (EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems). doi: 10.1109/EPEPS58208.2023.10314875

Ma, Hanzhi ; Tao, Tuomin ; Chen, Quankun et al. / Recent Progress on Signal Integrity Modeling of Neuromorphic Chips by the PEEC Method. EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems. Institute of Electrical and Electronics Engineers Inc., 2018. (EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems).

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Recent Progress on Signal Integrity Modeling of Neuromorphic Chips by the PEEC Method

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Online availability

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