@inproceedings{88bc51a6d3314e32bea1f6edfff72adc,
title = "Recent development of surface integral equation solvers for multiscale interconnects and circuits",
abstract = "This paper presents a brief review and recent development of surface integral equation solvers for multiscale interconnects and circuits modeling. As the future production processes down to 5 nm and the operating frequency increases, both multi-scale and large-scale natures should be taken into account in the electromagnetic simulations. Fast, efficient, stable, and broadband integral equation based solvers become indispensable when millions or ten s of millions of unknowns might be involved in the simulation of the integrated circuit. Recent progress and our latest researches in the development of broadband fast electromagnetic solvers will be demonstrated.",
keywords = "circuit modeling, computational electromagnetics, integral equation, interconnects, multiscale",
author = "Sheng Sun and Lijun Jiang and Chew, {Weng Cho}",
year = "2013",
month = dec,
day = "23",
doi = "10.1109/EDSSC.2013.6628158",
language = "English (US)",
isbn = "9781467325233",
series = "2013 IEEE International Conference of Electron Devices and Solid-State Circuits, EDSSC 2013",
booktitle = "2013 IEEE International Conference of Electron Devices and Solid-State Circuits, EDSSC 2013",
note = "2013 IEEE International Conference of Electron Devices and Solid-State Circuits, EDSSC 2013 ; Conference date: 03-06-2013 Through 05-06-2013",
}