Recent development of surface integral equation solvers for multiscale interconnects and circuits

Sheng Sun, Lijun Jiang, Weng Cho Chew

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a brief review and recent development of surface integral equation solvers for multiscale interconnects and circuits modeling. As the future production processes down to 5 nm and the operating frequency increases, both multi-scale and large-scale natures should be taken into account in the electromagnetic simulations. Fast, efficient, stable, and broadband integral equation based solvers become indispensable when millions or ten s of millions of unknowns might be involved in the simulation of the integrated circuit. Recent progress and our latest researches in the development of broadband fast electromagnetic solvers will be demonstrated.

Original languageEnglish (US)
Title of host publication2013 IEEE International Conference of Electron Devices and Solid-State Circuits, EDSSC 2013
DOIs
StatePublished - Dec 23 2013
Event2013 IEEE International Conference of Electron Devices and Solid-State Circuits, EDSSC 2013 - Hong Kong, Hong Kong
Duration: Jun 3 2013Jun 5 2013

Publication series

Name2013 IEEE International Conference of Electron Devices and Solid-State Circuits, EDSSC 2013

Other

Other2013 IEEE International Conference of Electron Devices and Solid-State Circuits, EDSSC 2013
CountryHong Kong
CityHong Kong
Period6/3/136/5/13

Keywords

  • circuit modeling
  • computational electromagnetics
  • integral equation
  • interconnects
  • multiscale

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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