Keyphrases
Cu(111)
100%
Dissociation
100%
Disilane
100%
Thin Film Growth Process
100%
SiH3
60%
Dihydrogen
40%
Temperature Range
20%
High Temperature
20%
Cu(111) Surface
20%
Desorption
20%
Low Flux
20%
Surface Coverage
20%
Atomic Mobility
20%
Surface Temperature
20%
Bond Scission
20%
Surface Binding
20%
Decomposition Process
20%
Coverage-dependent
20%
Low Energy Electron Diffraction
20%
Auger Electron Spectroscopy
20%
Bimolecular
20%
Silane
20%
Low Coverage
20%
High Coverage
20%
Dissociative Adsorption
20%
Thermally Stable
20%
High Heat Flux
20%
Recombinative Desorption
20%
Surface Phase
20%
Thermolytic
20%
Temperature Programmed Reaction
20%
H Atoms
20%
Intermetallic Thin Films
20%
Suicide
20%
Si-H Bonds
20%
Desorption Temperature
20%
Infrared Temperature
20%
Chemistry
Thin Film Growth
100%
Disilane
100%
Desorption
60%
formation
60%
Dihydrogen
40%
Spectroscopy
20%
Multilayer
20%
Low Energy Electron Diffraction
20%
Auger Electron Spectroscopy
20%
Dissociative Adsorption
20%
Atomic Emission Spectroscopy
20%
Silane
20%
Intermetallic Compound
20%
Material Science
Thin Film Growth
100%
Silane
100%
Surface (Surface Science)
100%
Desorption
42%
Thin Films
28%
Low-Energy Electron Diffraction
14%
Auger Electron Spectroscopy
14%
Intermetallics
14%
Chemical Engineering
Temperature Programmed Reaction
50%
Desorption Temperature
50%