Rational function fitting of electromagnetic transfer functions of interconnect structures via extrapolation in time and interpolation in frequency

Se Jung Moon, Andreas C Cangellaris

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new methodology is proposed for the rational function fitting of transfer functions of passive electromagnetic devices from numerically obtained and/or measured frequency-domain and time-domain response data. The proposed methodology combines the frequency-domain vector fitting process VECTFIT with its time-domain analog TDVF to yield a robust and versatile fitting algorithm for producing a rational function, broadband fit of the device response. The accuracy of the resulting algorithm is demonstrated through its application to the fitting of the admittance matrix of a lossy multiconductor transmission line system.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 56th Electronic Components and Technology Conference
Pages1251-1255
Number of pages5
DOIs
StatePublished - Dec 22 2006
EventIEEE 56th Electronic Components and Technology Conference - San Diego, CA, United States
Duration: May 30 2006Jun 2 2006

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2006
ISSN (Print)0569-5503

Other

OtherIEEE 56th Electronic Components and Technology Conference
CountryUnited States
CitySan Diego, CA
Period5/30/066/2/06

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Moon, S. J., & Cangellaris, A. C. (2006). Rational function fitting of electromagnetic transfer functions of interconnect structures via extrapolation in time and interpolation in frequency. In Proceedings - IEEE 56th Electronic Components and Technology Conference (pp. 1251-1255). [1645813] (Proceedings - Electronic Components and Technology Conference; Vol. 2006). https://doi.org/10.1109/ECTC.2006.1645813