Rapid thermal alloyed ohmic contact on inp

Keyphrases

• Alloying Techniques 33%
• Au Contacts 33%
• AuGe 33%
• Cm(III) 33%
• Contact Resistance 33%
• Contact Resistivity 33%
• Contact Surface 33%
• Electrical Characteristics 33%
• Electrical Properties 33%
• Essentially Smooth 33%
• Graphite 33%
• Heater 33%
• Interface Structure 33%
• Ion Implantation 33%
• Metallurgical Properties 33%
• Mixing Degree 33%
• Ni-Au 33%
• Ohmic Contact 100%
• Peak Concentration 33%
• Rapid Thermal Annealing 33%
• Resistivity Measurement 33%
• Rutherford Backscattering 33%
• Semi-insulating 33%
• Semiconductors 33%
• Smooth Surface 33%
• Specific Contact Resistance 33%
• Thin Metal Layer 33%
• Time Cycle 33%
• Wrinkling 33%

Material Science

• Alloying 100%
• Annealing 50%
• Contact Resistance 100%
• Electrical Property 50%
• Electrical Resistivity 50%
• Interface Structure 50%
• Thin Films 50%

Engineering

• Alloying 66%
• Contact Surface 33%
• Ohmic Contacts 100%
• Rapid Thermal Annealing 33%
• Smooth Surface 33%
• Temperature Time 33%
• Thin Films 33%