Rapid electromagnetic analysis of multilayer interconnects

D. Heckmann, S. L. Dvorak, A. C. Cangellaris

Research output: Contribution to conferencePaper

Abstract

In this paper, a closed-form solution is presented for the individual elements of the impedance matrix generated by the application of the Method of Moments to the integral equation solution of shielded multiconductor structures. Using these expressions, impedance matrix fill time is reduced by one to four orders of magnitude.

Original languageEnglish (US)
Pages232-235
Number of pages4
StatePublished - Dec 1 1997
Externally publishedYes
EventProceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging - San Jose, CA, USA
Duration: Oct 27 1997Oct 29 1997

Other

OtherProceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging
CitySan Jose, CA, USA
Period10/27/9710/29/97

Fingerprint

Multilayers
Method of moments
Integral equations

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Heckmann, D., Dvorak, S. L., & Cangellaris, A. C. (1997). Rapid electromagnetic analysis of multilayer interconnects. 232-235. Paper presented at Proceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, CA, USA, .

Rapid electromagnetic analysis of multilayer interconnects. / Heckmann, D.; Dvorak, S. L.; Cangellaris, A. C.

1997. 232-235 Paper presented at Proceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, CA, USA, .

Research output: Contribution to conferencePaper

Heckmann, D, Dvorak, SL & Cangellaris, AC 1997, 'Rapid electromagnetic analysis of multilayer interconnects' Paper presented at Proceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, CA, USA, 10/27/97 - 10/29/97, pp. 232-235.
Heckmann D, Dvorak SL, Cangellaris AC. Rapid electromagnetic analysis of multilayer interconnects. 1997. Paper presented at Proceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, CA, USA, .
Heckmann, D. ; Dvorak, S. L. ; Cangellaris, A. C. / Rapid electromagnetic analysis of multilayer interconnects. Paper presented at Proceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, CA, USA, .4 p.
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