Quantitative model-based interpretation of experimentally measured nanoscale stress sources at wafer bonded interfaces

G. Horn, H. T. Johnson, T. J. Mackin, J. R. Lesniak

Research output: Contribution to journalConference articlepeer-review

Fingerprint

Dive into the research topics of 'Quantitative model-based interpretation of experimentally measured nanoscale stress sources at wafer bonded interfaces'. Together they form a unique fingerprint.

Engineering & Materials Science