Pushing Low Thermal Conductivity to the Limit

Shi En Kim; David G. Cahill

doi:10.1126/science.abk1176

Pushing Low Thermal Conductivity to the Limit

Research output: Contribution to journal › Comment/debate › peer-review

Original language	English (US)
Pages (from-to)	963-964
Number of pages	2
Journal	Science
Volume	373
Issue number	6558
DOIs	https://doi.org/10.1126/science.abk1176
State	Published - Aug 27 2021

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title = "Pushing Low Thermal Conductivity to the Limit",

author = "Kim, {Shi En} and Cahill, {David G.}",

year = "2021",

month = aug,

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doi = "10.1126/science.abk1176",

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volume = "373",

pages = "963--964",

journal = "Science",

issn = "0036-8075",

publisher = "American Association for the Advancement of Science",

number = "6558",

}

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AU - Cahill, David G.

PY - 2021/8/27

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DO - 10.1126/science.abk1176

M3 - Comment/debate

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SP - 963

EP - 964

JO - Science

JF - Science

IS - 6558

ER -

Pushing Low Thermal Conductivity to the Limit

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