Progress on heterogeneous integration: Devices and processes

J. M. Dallesasse, B. Kesler, P. L. Lam, G. Walter

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The heterogeneous integration of compound semiconductors with silicon has been widely studied because of its potential for bringing photonic functionality and improved high-speed performance onto a semiconductor platform with a significant installed manufacturing base. Progress on heterogeneous integration processing methods and devices will be reviewed, and novel methods involving epitaxial transfer and photolithographic optical alignment as a vehicle for producing CMOS-scale electronic-photonic integrated circuits will be discussed. Progress on novel devices such as the light-emitting transistor as a fundamental circuit element for mixed electronic-photonic processing cores will also be presented.

Original languageEnglish (US)
Title of host publicationProceedings of the 2015 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages130-133
Number of pages4
ISBN (Electronic)9781479983636
DOIs
StatePublished - Sep 30 2015
Event11th IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015 - Singapore, Singapore
Duration: Jun 1 2015Jun 4 2015

Publication series

NameProceedings of the 2015 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015

Other

Other11th IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015
Country/TerritorySingapore
CitySingapore
Period6/1/156/4/15

Keywords

  • III-V semiconductor materials
  • Integrated optoelectronics
  • nanofabrication
  • optoelectronic devices
  • semiconductor materials
  • silicon
  • silicon photonics

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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