Printable semiconductor structures and related methods of making and assembling

Shawn Mack; Heung Cho Ko; Yugang Sun; Matthew Meitl; Dahl-Young Khang; Etienne Menard; Zhengtao Zhu; Keon Jae Lee; Ralph G Nuzzo; John A Rogers

Printable semiconductor structures and related methods of making and assembling

Shawn Mack (Inventor), Heung Cho Ko (Inventor), Yugang Sun (Inventor), Matthew Meitl (Inventor), Dahl-Young Khang (Inventor), Etienne Menard (Inventor), Zhengtao Zhu (Inventor), Keon Jae Lee (Inventor), Ralph G Nuzzo (Inventor), John A Rogers (Inventor)

Research output: Patent

Abstract

The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

Original language	English (US)
U.S. patent number	8039847
Filing date	7/27/10
State	Published - Oct 18 2011

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title = "Printable semiconductor structures and related methods of making and assembling",

abstract = "The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.",

author = "Shawn Mack and Ko, {Heung Cho} and Yugang Sun and Matthew Meitl and Dahl-Young Khang and Etienne Menard and Zhengtao Zhu and Lee, {Keon Jae} and Nuzzo, {Ralph G} and Rogers, {John A}",

note = "STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made, at least in part, with United States governmental support awarded by Department of Energy under Grant No. DEFG02-91ER45439 and the Defense Advanced Projects Agency under Contract F8650-04-C-710. The United States Government has certain rights in this invention.; 8039847",

year = "2011",

month = oct,

day = "18",

language = "English (US)",

type = "Patent",

}

TY - PAT

T1 - Printable semiconductor structures and related methods of making and assembling

AU - Mack, Shawn

AU - Ko, Heung Cho

AU - Sun, Yugang

AU - Meitl, Matthew

AU - Khang, Dahl-Young

AU - Menard, Etienne

AU - Zhu, Zhengtao

AU - Lee, Keon Jae

AU - Nuzzo, Ralph G

AU - Rogers, John A

N1 - STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made, at least in part, with United States governmental support awarded by Department of Energy under Grant No. DEFG02-91ER45439 and the Defense Advanced Projects Agency under Contract F8650-04-C-710. The United States Government has certain rights in this invention.

PY - 2011/10/18

Y1 - 2011/10/18

N2 - The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

AB - The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

M3 - Patent

M1 - 8039847

Y2 - 2010/07/27

ER -

Printable semiconductor structures and related methods of making and assembling

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