Preserving reproducibility: Provenance and executable containers in DataONE data packages

Bryce Mecum, Matthew B. Jones, Dave Vieglais, Craig Willis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Many data packaging standards are available to researchers and data repository operators and the choice to use an existing standard or create a new one is challenging. We introduce the DataONE Data Package standard which is based on the existing OAI-ORE Resource Map standard. We describe the functionality Data Package provides, implementation considerations, compare it to existing standards, and discuss future extensions to the standard including the ability to describe execution environments via WholeTale 'Tales'' and alternate serialization formats.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 14th International Conference on eScience, e-Science 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages45-49
Number of pages5
ISBN (Electronic)9781538691564
DOIs
StatePublished - Dec 24 2018
Event14th IEEE International Conference on eScience, e-Science 2018 - Amsterdam, Netherlands
Duration: Oct 29 2018Nov 1 2018

Publication series

NameProceedings - IEEE 14th International Conference on eScience, e-Science 2018

Conference

Conference14th IEEE International Conference on eScience, e-Science 2018
CountryNetherlands
CityAmsterdam
Period10/29/1811/1/18

Keywords

  • Data packaging
  • DataONE
  • OAI-ORE
  • Reproducibility
  • Standards
  • WholeTale

ASJC Scopus subject areas

  • Computer Science Applications
  • Software
  • Ecological Modeling
  • Modeling and Simulation

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  • Cite this

    Mecum, B., Jones, M. B., Vieglais, D., & Willis, C. (2018). Preserving reproducibility: Provenance and executable containers in DataONE data packages. In Proceedings - IEEE 14th International Conference on eScience, e-Science 2018 (pp. 45-49). [8588638] (Proceedings - IEEE 14th International Conference on eScience, e-Science 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/eScience.2018.00019