Abstract
Electron-beam-induced deposition was used to create an ordered array of Pt seed clusters on a Au film onto which Cu was subsequently electrodeposited in the presence of additives. The Pt seed clusters were 25-30 nm diameter, positioned in square arrays of 200, 300, or 400 nm spacing, with overall dimensions of 5×5 μm. Electrodeposition was carried out in an acid sulfate bath containing additives. Image analysis methods were used to evaluate the probability of finding Cu nuclei at a given distance from a Pt seed cluster, as well as finding the nearest neighbor to any deposited Cu nucleus.
| Original language | English (US) |
|---|---|
| Pages (from-to) | D94-D96 |
| Journal | Electrochemical and Solid-State Letters |
| Volume | 11 |
| Issue number | 12 |
| DOIs | |
| State | Published - 2008 |
ASJC Scopus subject areas
- General Chemical Engineering
- Electrical and Electronic Engineering
- General Materials Science
- Electrochemistry
- Physical and Theoretical Chemistry