Preparation of uniform metal seed arrays for nucleation studies

Matthew Willis, Richard Alkire

Research output: Contribution to journalArticlepeer-review


Electron-beam-induced deposition was used to create an ordered array of Pt seed clusters on a Au film onto which Cu was subsequently electrodeposited in the presence of additives. The Pt seed clusters were 25-30 nm diameter, positioned in square arrays of 200, 300, or 400 nm spacing, with overall dimensions of 5×5 μm. Electrodeposition was carried out in an acid sulfate bath containing additives. Image analysis methods were used to evaluate the probability of finding Cu nuclei at a given distance from a Pt seed cluster, as well as finding the nearest neighbor to any deposited Cu nucleus.

Original languageEnglish (US)
Pages (from-to)D94-D96
JournalElectrochemical and Solid-State Letters
Issue number12
StatePublished - 2008

ASJC Scopus subject areas

  • General Chemical Engineering
  • Electrical and Electronic Engineering
  • General Materials Science
  • Electrochemistry
  • Physical and Theoretical Chemistry


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