Preparation of uniform metal seed arrays for nucleation studies

Matthew Willis, Richard C Alkire

Research output: Contribution to journalArticlepeer-review

Abstract

Electron-beam-induced deposition was used to create an ordered array of Pt seed clusters on a Au film onto which Cu was subsequently electrodeposited in the presence of additives. The Pt seed clusters were 25-30 nm diameter, positioned in square arrays of 200, 300, or 400 nm spacing, with overall dimensions of 5×5 μm. Electrodeposition was carried out in an acid sulfate bath containing additives. Image analysis methods were used to evaluate the probability of finding Cu nuclei at a given distance from a Pt seed cluster, as well as finding the nearest neighbor to any deposited Cu nucleus.

Original languageEnglish (US)
JournalElectrochemical and Solid-State Letters
Volume11
Issue number12
DOIs
StatePublished - Nov 3 2008

ASJC Scopus subject areas

  • Electrochemistry
  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Chemical Engineering(all)
  • Physical and Theoretical Chemistry

Fingerprint

Dive into the research topics of 'Preparation of uniform metal seed arrays for nucleation studies'. Together they form a unique fingerprint.

Cite this