Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling

Huicai Ma, Jingdong Guo, Jianqiang Chen, Di Wu, Zhiquan Liu, Qingsheng Zhu, Jianku Shang, Li Zhang, Hongyan Guo

Research output: Contribution to journalArticlepeer-review

Abstract

Considering the current induced voids flow will accelerate the creep strain rate and lower the strength of the solder, a current induced activation energy change, ΔQe is added in the Anand model. A lifetime prediction model was constructed based on linear damage rule for the current-thermal cycling coupling test. To verify the accuracy of the model, mean-time-to-failure (MTTF) of copper pillar has been experimentally and analytically investigated under the combination of thermal cycling with temperature range of −40 to 125 °C and a superimposed electric current with current densities of 17.4–22.4 × 104 A/cm2. The experimental results reveal that the MTTF sharply decreases with the increasing current density. The acceleration factors are calculated, which is consistent well with the prediction model.

Original languageEnglish (US)
Pages (from-to)1184-1190
Number of pages7
JournalJournal of Materials Science: Materials in Electronics
Volume27
Issue number2
DOIs
StatePublished - Feb 1 2016

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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