Plating of copper in tubular holes with rotating screw electrodes

M. Schwartz, W. Li, N. H. Phan, K. Nobe, A. J. Pearlstein

Research output: Contribution to journalArticle

Abstract

Electrodeposition of copper into tubular electrodes using co-axial rotating screw counterelectrodes (RSEs) was investigated, and the results are compared with the periodic oscillatory technique commonly used in plating through-holes. Two length-to-diameter aspect ratios (ARs) of 4:1 and 8:1 and acid copper sulfate solutions with and without brightener were studied. The horizontal oscillatory mode (HOM) produced non-uniform deposits for both ARs, the additio0n of brigthener being effective in minimizing high end-to-center deposit thickness ratios. The RSE mode provides enhanced mass transfer and reduced ohmic resistance in the hole, resulting in excellent thickness uniformity, especially with solutions containing brightener. With 4:1 AR holes, uniform deposits were obtained with a current density of 40 mA cm-2. However, a reduced current density of 10 mA cm-2 was required to produce the same uniformity in 8:1 AR holes with averaged end-to-center thickness ratios of 0.93:1.

Original languageEnglish (US)
Pages (from-to)269-274
Number of pages6
JournalSurface and Coatings Technology
Volume52
Issue number3
DOIs
StatePublished - May 20 1992

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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