Piezoelectric in situ transmission electron microscopy technique for direct observations of fatigue damage accumulation in constrained metallic thin films

X. Tan, T. Du, J. K. Shang

Research output: Contribution to journalArticlepeer-review

Abstract

A piezoelectric in situ transmission electron microscopy (TEM) technique has been developed to observe the damage mechanism in constrained metallic thin films under cyclic loading. The technique was based on the piezoelectric actuation of a multilayered structure in which a metallic thin film was sandwiched between a piezoelectric actuator and a silicon substrate. An alternating electric field with a static offset was applied on the piezoelectric actuator to drive the crack growth in the thin metallic layer while the sample was imaged in TEM. The technique was demonstrated on solder thin films where cavitation was found to be the dominant fatigue damage mechanism.

Original languageEnglish (US)
Pages (from-to)3946-3948
Number of pages3
JournalApplied Physics Letters
Volume80
Issue number21
DOIs
StatePublished - May 27 2002

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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