Abstract
The development of a physically consistent multi-conductor transmission line model for high-speed interconnects in lossy, dispersive dielectrics is presented. Based on this model, a methodology is proposed for the construction of SPICE-compatible equivalent circuits that take into account dielectric loss and dispersion.
| Original language | English (US) |
|---|---|
| Pages | 247-250 |
| Number of pages | 4 |
| State | Published - 2001 |
| Event | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, United States Duration: Oct 29 2001 → Oct 31 2001 |
Other
| Other | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| Country/Territory | United States |
| City | Cambridge, MA |
| Period | 10/29/01 → 10/31/01 |
ASJC Scopus subject areas
- General Engineering