Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

Karen M. Coperich, Jason Morsey, Andreas C Cangellaris, A. Ruehli

Research output: Contribution to conferencePaper

Abstract

The development of a physically consistent multi-conductor transmission line model for high-speed interconnects in lossy, dispersive dielectrics is presented. Based on this model, a methodology is proposed for the construction of SPICE-compatible equivalent circuits that take into account dielectric loss and dispersion.

Original languageEnglish (US)
Pages247-250
Number of pages4
StatePublished - Dec 1 2001
EventIEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, United States
Duration: Oct 29 2001Oct 31 2001

Other

OtherIEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging
CountryUnited States
CityCambridge, MA
Period10/29/0110/31/01

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Coperich, K. M., Morsey, J., Cangellaris, A. C., & Ruehli, A. (2001). Physically consistent transmission line models for high-speed interconnects in lossy dielectrics. 247-250. Paper presented at IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, Cambridge, MA, United States.