Photoresist contact patterning of quantum dot films

Seok Kim (Inventor), Moonsub Shim (Inventor), Jun Kyu Park (Inventor), Hohyun Keum (Inventor), Yiran Jiang (Inventor)

Research output: Patent


The present disclosure describes one or more embodiment of a method for creating a patterned quantum dot layer. The method includes bringing a patterning stamp in contact with a layer of quantum dots disposed on a substrate, the patterning stamp comprising a patterned photoresist layer disposed on an elastomer layer, such that a portion of the quantum dots in contact with the patterned photoresist layer adheres to the patterning stamp, the portion of the quantum dots being adhered quantum dots. The method also includes peeling the patterning stamp from the substrate with a peeling speed larger than a pre-determined peeling speed to remove the adhered quantum dots from the substrate. A remaining portion of the quantum dots forms a patterned quantum dot layer on the substrate.
Original languageEnglish (US)
U.S. patent number11152536
Filing date9/17/19
StatePublished - Oct 19 2021


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