TY - GEN
T1 - Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability
AU - Barwicz, Tymon
AU - Taira, Yoichi
AU - Lichoulas, Ted W.
AU - Boyer, Nicolas
AU - Numata, Hidetoshi
AU - Martin, Yves
AU - Nah, Jae Woong
AU - Takenobu, Shotaro
AU - Janta-Polczynski, Alexander
AU - Kimbrell, Eddie L.
AU - Leidy, Robert
AU - Khater, Marwan
AU - Kamlapurkar, Swetha
AU - Engelmann, Sebastian
AU - Vlasov, Yurii A.
AU - Fortier, Paul
N1 - Publisher Copyright:
© OSA 2015.
PY - 2015/3/13
Y1 - 2015/3/13
N2 - We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.
AB - We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.
UR - http://www.scopus.com/inward/record.url?scp=85085405540&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85085405540&partnerID=8YFLogxK
U2 - 10.1364/ofc.2015.w3h.4
DO - 10.1364/ofc.2015.w3h.4
M3 - Conference contribution
AN - SCOPUS:85085405540
T3 - Optical Fiber Communication Conference, OFC 2015
BT - Optical Fiber Communication Conference, OFC 2015
PB - OSA - The Optical Society
T2 - Optical Fiber Communication Conference, OFC 2015
Y2 - 22 March 2015 through 26 March 2015
ER -