Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability

Tymon Barwicz; Yoichi Taira; Ted W. Lichoulas; Nicolas Boyer; Hidetoshi Numata; Yves Martin; Jae Woong Nah; Shotaro Takenobu; Alexander Janta-Polczynski; Eddie L. Kimbrell; Robert Leidy; Marwan Khater; Swetha Kamlapurkar; Sebastian Engelmann; Yurii A. Vlasov; Paul Fortier

Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Hidetoshi Numata, Yves Martin, Jae Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.

Original language	English (US)
Title of host publication	Optical Fiber Communication Conference, OFC 2015
Publisher	OSA - The Optical Society
ISBN (Electronic)	9781557529374
State	Published - Mar 13 2015
Externally published	Yes
Event	Optical Fiber Communication Conference, OFC 2015 - Los Angeles, United States Duration: Mar 22 2015 → Mar 26 2015

Publication series

Name	Optical Fiber Communication Conference, OFC 2015

Other

Other	Optical Fiber Communication Conference, OFC 2015
Country/Territory	United States
City	Los Angeles
Period	3/22/15 → 3/26/15

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Computer Networks and Communications
Instrumentation
Atomic and Molecular Physics, and Optics

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Barwicz, T., Taira, Y., Lichoulas, T. W., Boyer, N., Numata, H., Martin, Y., Nah, J. W., Takenobu, S., Janta-Polczynski, A., Kimbrell, E. L., Leidy, R., Khater, M., Kamlapurkar, S., Engelmann, S., Vlasov, Y. A., & Fortier, P. (2015). Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. In Optical Fiber Communication Conference, OFC 2015 (Optical Fiber Communication Conference, OFC 2015). OSA - The Optical Society.

Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. / Barwicz, Tymon; Taira, Yoichi; Lichoulas, Ted W. et al.
Optical Fiber Communication Conference, OFC 2015. OSA - The Optical Society, 2015. (Optical Fiber Communication Conference, OFC 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Barwicz, T, Taira, Y, Lichoulas, TW, Boyer, N, Numata, H, Martin, Y, Nah, JW, Takenobu, S, Janta-Polczynski, A, Kimbrell, EL, Leidy, R, Khater, M, Kamlapurkar, S, Engelmann, S, Vlasov, YA & Fortier, P 2015, Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. in Optical Fiber Communication Conference, OFC 2015. Optical Fiber Communication Conference, OFC 2015, OSA - The Optical Society, Optical Fiber Communication Conference, OFC 2015, Los Angeles, United States, 3/22/15.

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abstract = "We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.",

author = "Tymon Barwicz and Yoichi Taira and Lichoulas, {Ted W.} and Nicolas Boyer and Hidetoshi Numata and Yves Martin and Nah, {Jae Woong} and Shotaro Takenobu and Alexander Janta-Polczynski and Kimbrell, {Eddie L.} and Robert Leidy and Marwan Khater and Swetha Kamlapurkar and Sebastian Engelmann and Vlasov, {Yurii A.} and Paul Fortier",

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language = "English (US)",

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AU - Barwicz, Tymon

AU - Taira, Yoichi

AU - Lichoulas, Ted W.

AU - Boyer, Nicolas

AU - Numata, Hidetoshi

AU - Martin, Yves

AU - Nah, Jae Woong

AU - Takenobu, Shotaro

AU - Janta-Polczynski, Alexander

AU - Kimbrell, Eddie L.

AU - Leidy, Robert

AU - Khater, Marwan

AU - Kamlapurkar, Swetha

AU - Engelmann, Sebastian

AU - Vlasov, Yurii A.

AU - Fortier, Paul

PY - 2015/3/13

Y1 - 2015/3/13

N2 - We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.

AB - We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.

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M3 - Conference contribution

T3 - Optical Fiber Communication Conference, OFC 2015

BT - Optical Fiber Communication Conference, OFC 2015

PB - OSA - The Optical Society

T2 - Optical Fiber Communication Conference, OFC 2015

Y2 - 22 March 2015 through 26 March 2015

ER -

Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability

Abstract

Publication series

Other

ASJC Scopus subject areas

Library availability

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