Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Hidetoshi Numata, Yves Martin, Jae Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.

Original languageEnglish (US)
Title of host publicationOptical Fiber Communication Conference, OFC 2015
PublisherOSA - The Optical Society
ISBN (Electronic)9781557529374
StatePublished - Mar 13 2015
Externally publishedYes
EventOptical Fiber Communication Conference, OFC 2015 - Los Angeles, United States
Duration: Mar 22 2015Mar 26 2015

Publication series

NameOptical Fiber Communication Conference, OFC 2015

Other

OtherOptical Fiber Communication Conference, OFC 2015
CountryUnited States
CityLos Angeles
Period3/22/153/26/15

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Computer Networks and Communications
  • Instrumentation
  • Atomic and Molecular Physics, and Optics

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  • Cite this

    Barwicz, T., Taira, Y., Lichoulas, T. W., Boyer, N., Numata, H., Martin, Y., Nah, J. W., Takenobu, S., Janta-Polczynski, A., Kimbrell, E. L., Leidy, R., Khater, M., Kamlapurkar, S., Engelmann, S., Vlasov, Y. A., & Fortier, P. (2015). Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. In Optical Fiber Communication Conference, OFC 2015 (Optical Fiber Communication Conference, OFC 2015). OSA - The Optical Society.